Hardware soldering tips

  • Thread starter Thread starter mijuu
  • Start date Start date
  • Views Views 12,832
  • Replies Replies 134
hmm tried soldering straight to a metal object for a ground example, solder just balls up and moves around with the iron. I think it's not sticking because the surfaces I'm soldering to aren't pads, possibly, fuck knows.

Whats the max recommended time to have the iron on a 3ds pad? 0.5mm tip. Im guessing one or 2 seconds.

Well it depends on what material you're soldering and how big it is, if it's too big the soldering iron won't be able to heat the surface up enough to make a good bond with the solder, I'd say 2-3 seconds is acceptable and 1 is ideal

EDIT: here's a good video (it's kinda long but I recommend watching it)

 
Last edited by dark_samus3,
Well it depends on what material you're soldering and how big it is, if it's too big the soldering iron won't be able to heat the surface up enough to make a good bond with the solder, I'd say 2-3 seconds is acceptable and 1 is ideal

EDIT: here's a good video (it's kinda long but I recommend watching it)




Im just gonna go ahead and do it bored of messing about now. Yea i think its the surfaces in the router thats the problem couldn't really find any decent surfaces in there to practice on.

Temperature of iron @ 350c ok?
 
Last edited by mijuu,
Im just gonna go ahead and do it bored of messing about now. Yea i think its the surfaces in the router thats the problem couldn't really find any decent surfaces in there to practice on.

Temperature of iron @ 350c ok?

Check the video in my edit above out for at least 10 minutes in and no I use around 400 to 425 C
 
Check the video in my edit above out for at least 10 minutes in and no I use around 400 to 425 C

so 400c and tin the wire and tin the pad. How i would tin the pad was initially heat it up for around a second maybe slightly more and then feed the tiniest bit of solder onto the pad next to the iron not directly on the iron, does that sound correct, am watching the vid also now.

Theres plenty of space between the pads so defo quite a bit of room for error here, i think.

Is this the correcting working area seems to be but this 3ds looks slightly different this one has a big chip, in the exmaple pics it doesn't have a chip. Scratch that it actually looks like some kind of pad.
 

Attachments

  • 1.jpg
    1.jpg
    231.5 KB · Views: 116
Last edited by mijuu,
so 400c and tin the wire and tin the pad. How i would tin the pad was initially heat it up for around a second maybe slightly more and then feed the tiniest bit of solder onto the pad next to the iron not directly on the iron, does that sound correct, am watching the vid also now.

Theres plenty of space between the pads so defo quite a bit of room for error here, i think.

Is this the correcting working area seems to be but this 3ds looks slightly different this one has a big chip, in the exmaple pics it doesn't have a chip. Scratch that it actually looks like some kind of pad.

It all sounds pretty good, in that picture the big chip (which is the NAND chip) was removed to find the pinout, and that is the correct working area
 
  • Like
Reactions: mijuu
Not a problem, hope you get your 3ds back up and running :)
its my gf's muhahahaha ;p

You know if checking with a multimeter when it's done I guess you would put one pin on your soldered point and another on the sd metal thing. But what measurement would you set on the multimeter?
 
its my gf's muhahahaha ;p

You know if checking with a multimeter when it's done I guess you would put one pin on your soldered point and another on the sd metal thing. But what measurement would you set on the multimeter?

You'd use anything in the ohms range... You'll see that there's just a 1 way over to the right if there isn't continuity and if there it is will display a value, pretty easy
 
Not a problem, hope you get your 3ds back up and running :)

Something confusing on the image ive got for the ground the quality of the image is poor. is where i marked x where ground should go. Also is that enough for tinning, looks ok to me.
 

Attachments

  • 1.jpg
    1.jpg
    296.7 KB · Views: 126
Something confusing on the image ive got for the ground the quality of the image is poor. is where i marked x where ground should go. Also is that enough for tinning, looks ok to me.
Looks good to me tinning wise... You'll figure out how the multimeter works when you use it, just set it to ohms (the thing that looks like a horse shoe) and as long as the value is low you'll be fine

EDIT: I'm not seeing any X on that pic
 
Last edited by dark_samus3,
Looks good to me tinning wise... You'll figure out how the multimeter works when you use it, just set it to ohms (the thing that looks like a horse shoe) and as long as the value is low you'll be fine

EDIT: I'm not seeing any X on that pic

bottom right red x. Also do you want to feed wires straight down to the chip or coming away at an angle, kind a hard to explain what i mean just these wire look thin and i wouldnt want to break the connections when putting the case back together.

I was going to feed them out to the right out of one of those holes in the corner. Would exposed bit of wire touching the back of the nand chip surface be bad?

--------------------- MERGED ---------------------------

Was thinking this
 

Attachments

  • 1.jpg
    1.jpg
    296.7 KB · Views: 137
  • 1.jpg
    1.jpg
    33.4 KB · Views: 112
Last edited by mijuu,
bottom right red x. Also do you want to feed wires straight down to the chip or coming away at an angle, kind a hard to explain what i mean just these wire look thin and i wouldnt want to break the connections when putting the case back together.

I was going to feed them out to the right out of one of those holes in the corner. Would exposed bit of wire touching the back of the nand chip surface be bad?

--------------------- MERGED ---------------------------

Was thinking this

I still don't see any red X lol

Um cut the shiny part of the wire back... Ideally you want this

Target sited
IMG_20151021_224124~01.jpg


Tinned
IMG_20151021_224226~01.jpg


Wire length vs pad size
IMG_20151021_224254~01.jpg


Soldered
IMG_20151021_224410~01.jpg


Also here's the picture you CLAIM has the red X that I cannot see modified to include the best place for ground

IMG_20151021_225414.jpg
 
Last edited by dark_samus3,
I still don't see any red X lol

Um cut the shiny part of the wire back... Ideally you want this

Target sited
View attachment 27666

Tinned
View attachment 27667

Wire length vs pad size
View attachment 27668

Soldered
View attachment 27669

Also here's the picture you CLAIM has the red X that I cannot see modified to include the best place for ground

View attachment 27673


how can i tell if ive lifted a pad, got the first one in real easy and this second one is being a right fucking pain.
 
Send a picture (try to focus it as best you can) and I'll try to help

alright got all three in now dont know why the second one was being such a bitch. is there anyway of telling whether i have ruined the second pad, it took way to long and i think its fucked. Anyway of finding out with a multimetre i have tried ohms but dont know what to do with the p[os and neg etc. tried a few things just stays on number one.

wierd the first and last went in really quickly no probs but that middle was for some reason a real pain.
 
Last edited by mijuu,
alright got all three in now dont know why the second one was being such a bitch. is there anyway of telling whether i have ruined the second pad, it took way to long and i think its fucked. Anyway of finding out with a multimetre i have tried ohms but dont know what to do with the p[os and neg etc. tried a few things just stays on number one.

wierd the first and last went in really quickly no probs but that middle was for some reason a real pain.


Take and put any lead on the pad that you soldered to and take the other and put it on the other side of the wire you soldered, as long as the pad didn't pop up off of the board you're probably fine
 
Last edited by dark_samus3,
Take and put any lead on the pad that you soldered to and take the other and put it on the other side of the wire you soldered, as long as the pad didn't pop up off of the board you're probably fine

so if i get some kind of ohm reading on the one i think is knackered it should be ok?
 

Site & Scene News

Popular threads in this forum