Interesting developments as of late it seems. But some queries arise though. Using the irfhs8342 mosfet on the back of the board seems like a real time saver and convenient placement indeed but my only buts are:
do i really wanna keep the Nintendo factory thermal paste on!? Can i trust them with good quality Soc paste or are they using budget paste.
The other gripe was the thickness of the mosfet, Does it stick out too much and cause potential 'poking out' from the rest of the components of the board. Will this do long-term damage down the line once the board is fitted back and resting the same direction the LCD is facing!?
Good stuff from
@abal1000x for the discovery and the rest of the gang. Neato!