No. Not at all.The physical process the chip and its transistors are built on is too small to analyze to any end.
No. Not at all.The physical process the chip and its transistors are built on is too small to analyze to any end.
The 3DS SoC is manufactured on a 45nm process. A chip at that fabrication size can be examined fairly good with just a regular scientific microscope. What, did you think people were just going to snap pictures of it with a regular DSLR? No. Or maybe you thought fabrication size meant the actual size of the chip? It doesn't, it's half the distance between components in a chip, so parts would be a full 90nm apart.How aren't they?
The 3DS SoC is manufactured on a 45nm process. A chip at that fabrication size can be examined fairly good with just a regular scientific microscope. What, did you think people were just going to snap pictures of it with a regular DSLR? No. Or maybe you thought fabrication size meant the actual size of the chip? It doesn't, it's half the distance between components in a chip, so parts would be a full 90nm apart.
We can tell 'the functions of the chip' just by looking at public docs.Also, we don't need to see individual transistors. We only need to see the relevant overall structure, the functions of the chip, not the transistors that make them up. These functions are many orders of magnitude larger, made up of many thousands of transistors each.
Also, a company that can do professional decapping is very much going to have the right tools to take close images of the chip, or else they would not make any damn business with it anymore since the decapping would be UTTERLY USELESS in this day and age, especially considering we have chips down to 22nm now and going lower next year.
Whereas a Pentium I had a process size of 1um (easily viewable), today intel is rolling out a process size of 22nm in Ivy Bridge. That is just a factor of 10 away from the width of DNA.
The 3DS SoC is manufactured on a 45nm process. A chip at that fabrication size can be examined fairly good with just a regular scientific microscope. What, did you think people were just going to snap pictures of it with a regular DSLR? No. Or maybe you thought fabrication size meant the actual size of the chip? It doesn't, it's half the distance between components in a chip, so parts would be a full 90nm apart.
Also, we don't need to see individual transistors. We only need to see the relevant overall structure, the functions of the chip, not the transistors that make them up. These functions are many orders of magnitude larger, made up of many thousands of transistors each.
Also, a company that can do professional decapping is very much going to have the right tools to take close images of the chip, or else they would not make any damn business with it anymore since the decapping would be UTTERLY USELESS in this day and age, especially considering we have chips down to 22nm now and going lower next year.
We can tell 'the functions of the chip' just by looking at public docs.
As for 'can be examined fairly good with just a regular scientific microscope.': http://siliconzoo.org/tutorial.html
You've provided no proof against it. He didn't claim you couldn't do it with current day processors, just that it's harder, and he also uses a 22nm CPU as an example. The 3DS is 45nm, more than twice the size. Not to mention any professional lab worth its salt, that deals in this kind of stuff, should have a scanning electron microscope for the job.We can tell 'the functions of the chip' just by looking at public docs.
As for 'can be examined fairly good with just a regular scientific microscope.': http://siliconzoo.org/tutorial.html
That's the point. How silly would it be if, N documents his keyscrambler? With decapping there is a chance to figure out how the keyscrambler works and it's possible to obtain the bootrom + KeyX. But that are the only interesting things.And no, you can read about the functions that Nintendo wants you to know about, by looking at the public docs, but not all of them, nor the flaws. And I'm not talking about the high level functions that utilize more basic functions to operate.
The whole thing? Daaaamn. Are there any die shots or chip schematics available?During my undergraduate I focused on computer architecture and VLSI design. I actually reverse-engineered and then reconstructed the original GameBoy SoC for one of my courses.
And no, you can read about the functions that Nintendo wants you to know about, by looking at the public docs, but not all of them, nor the flaws. And I'm not talking about the high level functions that utilize more basic functions to operate.
That's the point. How silly would it be if, N documents his keyscrambler? With decapping there is a chance to figure out how the keyscrambler works and it's possible to obtain the bootrom + KeyX. But that are the only interesting things.
The whole thing? Daaaamn. Are there any die shots or chip schematics available?
Public docs are fine and dandy but things like private encryption keys and signatures or boot ROMs burnt into the chip are not going to be in those. That's the kind of things you can't quite pull out of it by just looking at the top layer of the chip with a normal microscope. There's also plenty of stuff that's not in public docs. There are some documents that the manufacturer will only release to the buyer and when the contract states that the buyer can only be Nintendo ... you get the idea.We can tell 'the functions of the chip' just by looking at public docs.
As for 'can be examined fairly good with just a regular scientific microscope.': http://siliconzoo.org/tutorial.html
But this picture says over 9000 words!
Phd. Stuff.
except talk is cheap...
Ontopic: Like others have said, while theres no downside to decapping, there may also be no upside. We just don't know until one is done.
Well, uh, thanks lol. Don't understand what I did, but yeah!Totally off subject but I just want to say, mansonss, you're like the coolest guy ever. Just saying.
For reference, you can find the final presentation my group gave on the GameBoy CPU here. We discuss the layout in the presentation. The squares with the crazy, angular and colored lines represent what the chip would actually look like on die. Good luck figuring out what that does.
From my perspective it seems like this went above and beyond the complexity you were expecting when starting the project ?
Y-you mean to say I can't just throw a jpeg photo of the chip at IDA to get decompiled Verilog code instantly? Oh well, better start training a neural network now...You guys are all acting like you'd be able to just grab the pictures and go. Deciphering functionality from layout is incredibly difficult, and is a very rare skill to have. Even simple structures like a MUX or one-hot encoder end up looking insane - even more so with today's processes. You also have to consider that layout is performed by computers using complex algorithms, not humans, so the layout is super efficient, not super easy to read.
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