It's super easy, because for some reason, this device is the only one that uses a separate pcb for eMMC, that connects with a "lego" connector..
Now I am getting excited. Using that lego connector would make you think N intended to launch models with larger internal storage (fingers crossed).
Curious, have you scoped the chip series to see what the largest size compatible chip could be used? Is there anything unique about the pcb that we would need to lift the chip or find an un-populated Nintendo pcb or do you think a knockoff pcb could be cooked up with a compatible larger Nand?
Do you already have an idea on what it will take to modify the injection payload to make it work, from what you said earlier about Nand using fat file system, isn't it just going to be injecting a hex edit to the proper location to change the partition table, or am I oversimplifying it?