3DS hardware specs not revealed yet ?

Discussion in '3DS - Console, Accessories and Hardware' started by PunchOut, May 29, 2011.

May 29, 2011
  1. PunchOut
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    Newcomer PunchOut Member

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    Hi !

    It's been 3 month that 3DS was released, and nobody could confirm or deny the rumored IGN specs ?
    IGN told there's 2xARM11 at 266mhz, 64mo of ram and Pica200 at 133 mhz but...
    I wonder if these specs are true, because now we know that in fact, it's 128mo of FCRAM instead of 64mo of ram.
    So IGN was wrong about it, but could they've been wrong about the CPU and the GPU frequency ?
    I mean, FCRAM is a fast memory, so could the ARM11 handle that type of memory ?
    Or maybe the 3DS has a Cortex A5 dual core that could handle that memory ?
    About the Pica200, any news about the frequency ?



    Sorry for my weird english.
     
  2. heartgold

    Member heartgold GBAtemp Psycho!

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    Simple answer, we don't know anything apart from the ram.
     
  3. pachura

    Member pachura GBAtemp Advanced Fan

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    As I've written in another post, these specs are believable, but not confirmed. Ripping 3DS open does not help as CPU & GPU are put on one custom chip labeled "CPU CTR Nintendo ARM" - and that's it... I guess only people who bought 3DS development units know for sure, but they have to keep quiet having signed NDA.
     
  4. WiiUBricker

    Member WiiUBricker Insert Custom Title

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    All specs you can find in the internet are rumors, including those from 3dbrew and other Wikis. Nothing has been confirmed yet. Talk about hacking the 3DS, lol.
     
  5. Zeroneo

    Member Zeroneo GBAtemp Fan

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  6. Melter

    Member Melter GBAtemp Regular

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    what is known so far:

    Battery: 3.7V 1300mAh 5Wh Li-Ion

    Wifi: Atheros AR6014 802.11 b/g

    IR Controller: NXP Model S750 0803 TSD031C

    CPU: Nintendo 1048 0H ARM (likely ARM11, but not confirmed)

    RAM: Fujitsu MB82M8080-07L 128MB FCRAM at 3.2GB/s (SOURCE)

    NAND Flash: Toshiba THGBM2G3P1FBAI8 2GB (onboard memory for the firmware)

    GPU: Texas Instruments PAIC3010B 0AA37DW (PICA 200)

    More info on the GPU: (SOURCE)
    Code:
    Uses the OpenGL ES 1.1 API + DMP's proprietary MAESTRO-2G technology
    
    Specs:
    Clock 200 MHz (max. clock frequency 400 MHz @65 nm)
    pixel performance: 800 Mpixel/s (400 Mpixel/s @100 MHz)(1600 Mpixel/s@400 MHZ)
    vertex performance: 15.3 Mpolygon/s (40Mtriangle/s @100 MHz)(160Mtriangle/s @400 MHz)
    Power consumption: 0.5-1.0 mW/MHz
    Frame Buffer max. 4095x4095 pixels
    Supported pixel formats: RGBA 4-4-4-4, RGB 5-6-5, RGBA 5-5-5-1, RGBA 8-8-8-8
    Vertex program (ARB_vertex_program)
    Render-to-Texture
    MipMap
    Bilinear texture filtering
    Alpha blending
    Full-scene anti-aliasing (2x2)
    Polygon offset
    8-bit stencil buffer
    24-bit depth buffer
    Single/Double/Triple buffer
    DMP's MAESTRO-2G technology
    per pixel lighting
    procedural texture
    refraction mapping
    subdivision primitive
    shadow
    gaseous object rendering
    Gyroscope: Invensense ITG-3270 MEMS

    Accelerometer: ST Micro 2048 33DH X1MAQ

    Cameras: One 2D front-facing and two 3D rear-facing 0.3 MP (VGA)

    Bottom Screen: 3.02 in, 320 × 240 QVGA, 24-bit (16 million colors)

    Top Screen: Sharp Autostereoscopic 3.53 in, 400 × 240 (2D) or 800 x 240 (3D), 24-bit (16 million colors)
     

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