Homebrew Discussion Switch overclocking released (improved N64 & PSX emu)

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Yeah it's crazy to think people want something that's new/unreleased/exciting!!
I understand why everyone wants it but your all crying in here like you've heard news that it's not goin to get released. Patience guys..... I no your arms must be aching holding them out for so long
 
I understand why everyone wants it but your all crying in here like you've heard news that it's not goin to get released. Patience guys..... I no your arms must be aching holding them out for so long

No one's even remotely acting like that, if you're trying to start something just don't...
 
well overclocking seems cool we just have to be awear of heat, and power consumption even in docked mode. i have no idea what that adapter is rated up to but we best be careful on how much juice we tell it to pull. what kind of frequences are we looking at?
 
I honestly don't feel to overclock. Has there been a fix for PSX games? Before the switch retroarch overhaul with the cool XMB, it was running perfectly. Now I have to play around with some video setting to make it run at acceptable FPS.
 
well overclocking seems cool we just have to be awear of heat, and power consumption even in docked mode. i have no idea what that adapter is rated up to but we best be careful on how much juice we tell it to pull. what kind of frequences are we looking at?
having played a whole lot of psx lately, I'm always surprised how little energy its actually pulling.
i sometimes wonder if psxrearmed actually uses all system ressources at all
 
To be honest, I'm not sure if redo'ing the thermal paste is needed for an overclock, but it certainly won't hurt because:
  1. The thermal paste on the switch is low-quality and dries out after a year.
  2. The people/machines putting it on are inconsistent or the paste has weird properties that aren't desirable, because 3/4 of my thermal paste was on top of the heatsink, not under it. There was also none in the center and it was crusty around the sides of the copper plate. Aside from that, it was stuck all over the shield, meaning they really did not apply it properly (e.g. center dot, spread)
In my case, I replaced the paste with MX-4 since I wasn't sure if the switch was safe to use a potentially capacitive paste on.

you seem to know your stuff, do you have any experience with thermal paste like K5 Pro as a thermal pad alternative?
when i first looked into repasting, people either put in randomly (seemingly too thick) pads that caused slight denting which seemed problematic or just used whatever was already inside, which i thought was kind of a grave sin in thermal management.

paste seems like a userfriendly alternative to replace the pads but i hear different things about how well it distributes heat.

also, if i remember right, some people entirely removed some part in the process, not sure if it was the copper shim or the housing around the processor, did you do that too?
 
Last edited by Clydefrosch,
you seem to know your stuff, do you have any experience with thermal paste as a thermal pad alternative?
when i first looked into repasting, people either put in randomly (seemingly too thick) pads that caused slight denting which seemed problematic or just used whatever was already inside, which i thought was kind of a grave sin in thermal management.

paste seems like a userfriendly alternative to replace the pads but i hear different things about how well it distributes heat.

No clue, sorry. Thermal pads aren't my area of expertise. I know this stuff because I built my desktop from components and have been replacing crappy paste on my various electronics over the years, but I never have really needed to deal with thermal pads.

also, if i remember right, some people entirely removed some part in the process, not sure if it was the copper shim or the housing around the processor, did you do that too?

I did not remove the shielding or the copper. There's almost always a reason for shielding, be it RF-related or heat, so I'm not one to remove it unless I need to get under it.
 
I did not remove the shielding or the copper. There's almost always a reason for shielding, be it RF-related or heat, so I'm not one to remove it unless I need to get under it.
To anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)
You did the right thing^^

What actually is the top "safe" speed then, before heat-related issues start to crop up? Assuming the user hasn't put arctic silver on the processor.
1.5 GHz is what I consider the max safe speed for the avg end user.
I wouldn't use 1.75GHz in combination of a GPU OC (past docked clocks) or if I am aware that my switch has a clogged fan or smth.
Battery drain is somewhat minor. Not much different from running a title in handheld (full load)
There is a noticeable temp diff from 1.5 to 1.75, but it's still less than any heat produced from the GPU with the docked OC.


I was attempting something similar a few weeks ago with PPC/apm: performance profiles
Did that first, caused stability issues in the early bootchain.

but I quickly realized that was the wrong approach to overclocking once pcv support was merged into libnx
Heh that was a nice surprise. Was about to do it myself already. Tho i didn't want to expose them publicly in libnx, oh well.

The mitm API in libstratosphere REALLY needs documentation, so I kinda get why this is taking a while. Take your time.
It's fairly straightforward, but currently we don't actually use libstratrosphere, I just hacked something together. Maybe we will change that because it look's somewhat cleaner than what I have right now

An SDEV unit could be running at 1.224Ghz. I suppose that's irrelevant, though.
I guess thats a valid point.
 
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No clue, sorry. Thermal pads aren't my area of expertise. I know this stuff because I built my desktop from components and have been replacing crappy paste on my various electronics over the years, but I never have really needed to deal with thermal pads.

I did not remove the shielding or the copper. There's almost always a reason for shielding, be it RF-related or heat, so I'm not one to remove it unless I need to get under it.

i see, ok.
well, if i ever have the nerves to open mine up, I'll just have to try it. seems like the pads in the videos back then actually were thrown in additionally to help move heat to the metal casing so they're likely not really necessary anyways.

--------------------- MERGED ---------------------------

To anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)
You did the right thing^^
just to be clear, the part i was refering to was that thick T-shaped cover over the ram
https://d3nevzfk7ii3be.cloudfront.net/igi/kuGkQTMR6atCWRKt.huge

one person removed that and the shim while another just removed the shim, so "the heatpipe had direct contact to the chip"
 
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To anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)
You did the right thing^^

:toot:

1.5 GHz is what I consider the max safe speed for the avg end user.
I wouldn't use 1.75GHz in combination of a GPU OC (past docked clocks) or if I am aware that my switch has a clogged fan or smth.
Battery drain is somewhat minor. Not much different from running a title in handheld (full load)
There is a noticeable temp diff from 1.5 to 1.75, but it's still less than any heat produced from the GPU with the docked OC.

Noted. I figured it was something like that since the CPU and GPU are in the same SoC.

Did that first, caused stability issues in the early bootchain.

Setting a docked or SDEV profile causes some uh...strange-ass lag. Especially with early boot. I measured what the heck happened by with a CPU MIPS/stress test and it came out at roughly 0.25Ghz-0.30Ghz. I'm making a wild guess that there's some bug at work.

Either way, I shelved it.:sleep:

Wow thats even way fucking worse.

I knew that was what he was talking about, but why people remove things that serve a function I do not grasp. You put things back how you found it. It's engineered that way for a reason.
 
Last edited by chaoskagami,
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So, is OC almost here or did I misunderstood the post with link to github diff file?
 
Wow thats even way fucking worse.

they did fill the gap to the metal casing with thermal pads though.
i guess their reasoning was that going through the shim and the metal shielding with multiple layers of cooling paste/pads would ultimately slow down heat dissipation or something
 
Last edited by Clydefrosch,

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