And it's just normal.Yeah it's crazy to think people want something that's new/unreleased/exciting!!
And it's just normal.Yeah it's crazy to think people want something that's new/unreleased/exciting!!
Um, yeah. That's how GPL licensed software tends to work...You forgot free.
They always want free.
I understand why everyone wants it but your all crying in here like you've heard news that it's not goin to get released. Patience guys..... I no your arms must be aching holding them out for so longYeah it's crazy to think people want something that's new/unreleased/exciting!!
I understand why everyone wants it but your all crying in here like you've heard news that it's not goin to get released. Patience guys..... I no your arms must be aching holding them out for so long

having played a whole lot of psx lately, I'm always surprised how little energy its actually pulling.well overclocking seems cool we just have to be awear of heat, and power consumption even in docked mode. i have no idea what that adapter is rated up to but we best be careful on how much juice we tell it to pull. what kind of frequences are we looking at?
To be honest, I'm not sure if redo'ing the thermal paste is needed for an overclock, but it certainly won't hurt because:
In my case, I replaced the paste with MX-4 since I wasn't sure if the switch was safe to use a potentially capacitive paste on.
- The thermal paste on the switch is low-quality and dries out after a year.
- The people/machines putting it on are inconsistent or the paste has weird properties that aren't desirable, because 3/4 of my thermal paste was on top of the heatsink, not under it. There was also none in the center and it was crusty around the sides of the copper plate. Aside from that, it was stuck all over the shield, meaning they really did not apply it properly (e.g. center dot, spread)
You needed these settings before, I just bundled a config.Now I have to play around with some video setting to make it run at acceptable FPS.

you seem to know your stuff, do you have any experience with thermal paste as a thermal pad alternative?
when i first looked into repasting, people either put in randomly (seemingly too thick) pads that caused slight denting which seemed problematic or just used whatever was already inside, which i thought was kind of a grave sin in thermal management.
paste seems like a userfriendly alternative to replace the pads but i hear different things about how well it distributes heat.
also, if i remember right, some people entirely removed some part in the process, not sure if it was the copper shim or the housing around the processor, did you do that too?
To anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)I did not remove the shielding or the copper. There's almost always a reason for shielding, be it RF-related or heat, so I'm not one to remove it unless I need to get under it.
1.5 GHz is what I consider the max safe speed for the avg end user.What actually is the top "safe" speed then, before heat-related issues start to crop up? Assuming the user hasn't put arctic silver on the processor.
Did that first, caused stability issues in the early bootchain.I was attempting something similar a few weeks ago with PPC/apm: performance profiles
Heh that was a nice surprise. Was about to do it myself already. Tho i didn't want to expose them publicly in libnx, oh well.but I quickly realized that was the wrong approach to overclocking once pcv support was merged into libnx
It's fairly straightforward, but currently we don't actually use libstratrosphere, I just hacked something together. Maybe we will change that because it look's somewhat cleaner than what I have right nowThe mitm API in libstratosphere REALLY needs documentation, so I kinda get why this is taking a while. Take your time.
I guess thats a valid point.An SDEV unit could be running at 1.224Ghz. I suppose that's irrelevant, though.
No clue, sorry. Thermal pads aren't my area of expertise. I know this stuff because I built my desktop from components and have been replacing crappy paste on my various electronics over the years, but I never have really needed to deal with thermal pads.
I did not remove the shielding or the copper. There's almost always a reason for shielding, be it RF-related or heat, so I'm not one to remove it unless I need to get under it.
just to be clear, the part i was refering to was that thick T-shaped cover over the ramTo anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)
You did the right thing^^
Wow thats even way fucking worse.just to be clear, the part i was refering to was that thick T-shaped cover over the ram
https://d3nevzfk7ii3be.cloudfront.net/igi/kuGkQTMR6atCWRKt.huge
one person removed that and the shim while another just removed the shim, so "the heatpipe had direct contact to the chip"

To anyone reading it, PLEASE NEVER REMOVE THE HEATSINK ON THE BACK! (looking at you transparent case ppl)
You did the right thing^^
1.5 GHz is what I consider the max safe speed for the avg end user.
I wouldn't use 1.75GHz in combination of a GPU OC (past docked clocks) or if I am aware that my switch has a clogged fan or smth.
Battery drain is somewhat minor. Not much different from running a title in handheld (full load)
There is a noticeable temp diff from 1.5 to 1.75, but it's still less than any heat produced from the GPU with the docked OC.
Did that first, caused stability issues in the early bootchain.
Wow thats even way fucking worse.
Wow thats even way fucking worse.
Yep that was it. Now it's up to you to compile it for us since no one else will.So, is OC almost here or did I misunderstood the post with link to github diff file?


