So the reason I chose that GND was out of sheer convince and I don't like applying any more heat then I have to on the board, i.e. on metal shielding because it can soak a lot of it. The pin is outta of the way from any major chip so I didn't need to to route it and it's another wire I didn't need on the reserve side.
On the note of test pads, that is not likely going to happen. These board get made and special jig are made to test all the logic, and components, I'm sure boundary scans are done as well. Also the boards are still hand inspected and tested I assume because they have scribbled markings on them in marker.
I am just glad to have the older information to work with so I don't have to remove any of the chips myself, but having a logic analyzer can be quite useful even when you don't exactly know what you are looking.
I have one from the MH4U and interestingly it was only dumping files that were 1.2GB so something is wrong there, same board but different memory module, using a Samsung one. I hope the red one the gf has a different board as well, it'd be nice to get info for all of them out there. I am considering updating my N3DS and then restoring the NAND but first I am going to try to inspect the files and make sure they are not all FFs or something silly...