I read that the WiFi IC on the Nintendo Switch can break, requiring reflowing / reballing / replacement. Can this be prevented by placing a thermal pad between the WiFi IC and the RF shield?
This would prevent the IC from overheating and breaking the connections underneath it, I think. It would at least remove a bit of heat from the chip. Unless the breakage is caused by something else.
Let me know what you guys think.
This would prevent the IC from overheating and breaking the connections underneath it, I think. It would at least remove a bit of heat from the chip. Unless the breakage is caused by something else.
Let me know what you guys think.
