I am not sure how this plays out here.
The really bad RRoD we are concerned with here (so not bad updates or dead hard drives) is caused by two main things troubling the CPU and GPU.
1) Nasty lead free solder having fun with creep, oxidation, possibly some whiskers, and whatever else.
2) Bond wires breaking within chips. Said chips are usually tied to the device (or at least the image on the NAND) as well which means having a line on replacement won't do too much for you unless you have the NAND to go with it, and said CPU is on old enough efuses itself to continue allowing NXE dashboards (or you slap it hard enough to use hacks).
In both cases more heat is not good for it and will raise the likelihood of it happening sooner. Less heat and less usage both helping matters here, though there is nothing like "reinforce this, keep it below 60 and it will outlive you" here. Amusingly a higher dose of heat, aka reflow, might allow it to reform a connection in both 1) and 2) to get it working for a little while longer, though such things are seldom permanent.
You could pre-emptively reball it but... lipstick on a pig, paper over the cracks, polish a turd, plaster on a gunshot wound, silk purse out of a sow's ear; pick your favourite there.
At the same time if this is some 14 years (possibly 14 years in a nice hot garage or attic heating and cooling cycles) then that is enough for long term effects to take hold as well. I haven't dealt with enough stuff like this to know what goes here -- car stuff is one thing and I see bad joints there all the time but they are usually used, higher current, subject to force, and larger joints, also possibly still lead based in some cases.
