Got my WASP Fusion hooked up to a MEGAdrive v3 for my IPL1.1 Gamecube (for now, it's going in a Panasonic Q later).
On the MEGAdrive, there are 2 sets of solder pads: a LID group, and P29/GND. What do each of these do, and when should each be bridged?
On the MEGAdrive, there are 2 sets of solder pads: a LID group, and P29/GND. What do each of these do, and when should each be bridged?
like a 250 dollar kit back when DDR4 was Intel only