Hey All,
Switch - V2 - 2019.
I'm planning to remove the shim covering the SoC and put thermal pads in between (on top of the modules so they touch the shim), hoping to dissipate heat.
And then on top of the shim, between the shim and backplate so that the heat will be transferred to the backplate.
Pictures below, is this a good idea? if the shim gets a lot of heat due to SoC than the memory module, then more heat can be transferred to the modules so I'm holding off until I get some expert advice on this.
Switch - V2 - 2019.
I'm planning to remove the shim covering the SoC and put thermal pads in between (on top of the modules so they touch the shim), hoping to dissipate heat.
And then on top of the shim, between the shim and backplate so that the heat will be transferred to the backplate.
Pictures below, is this a good idea? if the shim gets a lot of heat due to SoC than the memory module, then more heat can be transferred to the modules so I'm holding off until I get some expert advice on this.