Hey guys, I did my first conversion yesterday. It worked well. I'll do one thing differently next time, but that's just a detail.
In order to avoid a possible undesirable development, I am now concerned with the question of whether problems can later occur in the various work areas for the conversion with HWFly on the OLED mainboard due to the console's own heat (when playing games).
For example at the soldering points of the
-CPU Flex Ribbon Cable
and especially at the soldering points
-DAT0 adapter (C-Point) with or without hot air.
as well as
- Conversion without DAT-0 adapter (reballing)
I would be very happy to have a discussion about this...
In order to avoid a possible undesirable development, I am now concerned with the question of whether problems can later occur in the various work areas for the conversion with HWFly on the OLED mainboard due to the console's own heat (when playing games).
For example at the soldering points of the
-CPU Flex Ribbon Cable
and especially at the soldering points
-DAT0 adapter (C-Point) with or without hot air.
as well as
- Conversion without DAT-0 adapter (reballing)
I would be very happy to have a discussion about this...