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Die-bonding... I looked for about 10 minutes and couldn't come up with a name for it (closest I got was "flip-chip").
I was thinking more along the lines of a 250-300 degree iron and a good little knife to remove the outer edge of the epoxy to get at the very edge of the template... to provide the trace they removed. If one knew what that chip was (custom jobbie?) it might be much simpler to replace it with one that is in a package via a heat gun and a good knife.
die-bonding is proper tech term.
http://www.cil-uk.co.uk/amt/amt.htm
flip-chip is ic packaging term, it means the silicon is 'bonds down' on the package base - this technology has no bond wires.
dont try to decapsulate the plastic. and there is no replacement chip, its full custom made ASIC so can not buy or obtain it.
