Well, here's my problem. I was modding a D2B (the 3 cut legs), and all was going well. I decided to grind down the IC some, expose the internal traces, and then solder directly to them. I tossed in my YAOSM into the machine and it booted GCOS. So, I go to close the Wii up, and apparently one of my wires wasn't as secure as I thought. Once the system is closed the Wii no longer boots backups. I reopen the system to find one of the exposed traces on the IC is now ripped off, meaning there isn't enough remaining to solder to. My question is now.. can I grind the IC back any further? I don't have a camera to take photos of my work, but it's basically the same amount of grind you see with any other D2B chip installation (though, I wish I attempted the pin rebuild, but I was working off old information). Any info would be helpful. Thanks.