You are wrong, you wouldn't leave any flux because you don't need to use any to tack a 30AWG wire into one of those solder points. I have been in electronics for 20 years. Run 2 manufacturing organizations, run a warranty repair program, and have owned multiple product development companies. I am sure I have soldered far more than you and inspected far more solder joints for IPC compliance, training, and failure analysis (of course I am just guessing but statistically I am probably right
).
Anyway we won't be able to resolve it without showing each other pictures and saying "which one has been touched". I don't think either of us is that motivated so let's leave it as a friendly impasse and agree to disagree.
The reality is no warrant program is going to include inspection of solder joints and removal of foam to inspect solder solder points. It would never fit the warranty cost model, and likely wouldn't be a point of note for failure analysis and any Kaizen (Japanese) or 6-sigma improvement program.
I'm not sure anyone really cares who is right anyway.