Thanks for the replies guys!
Fusee Gelee with an internal modchip would be totally fine with me. I'm on 3.0.0 and would only not update if I knew that 3.0.0 had a coldboot exploit. I guess I'll wait what happens. Would be awesome if the devs could tell us what to expect from the release.
I'm also waiting for TX upcoming soldering modchip and emunand, I still won't update my 3.02 Switch, because later if the warmboot comes out working and if it would be as easy as like launching Gateway emunand on the 3DS minus the flashcard, I would totally de-solder the TX chip and use that warmboot.
I actually still use GW emunand and I don't find it any hassle just having to press settings and profile to load it, they really made it hassle free. Hope Warmboot if it ever gets used would be as hassle free as GW
.
And your FW3.0 is still not a excluded possibility from having a COLDBOOT in the future which is reported up to 3.01, but Warmboot will come first and coldboot might actually never happen above the FW1.0, but hell theres always that small chance that we got to have faith
(Faith moves mountains or not
).
I believe they all require user interaction and possibly WiFi
I think all the warmboots will probably sadly need it, but I wish they can make it without Wifi, but even if it needs wifi its not that much of a hassle as I always have my phone with me and with a touch or 2 in the screen I can easily make a wireless LAN, hope it will not require too much steps though
.
Well at least FW1.0 if it really gets the coldboot soon will be really GOLD and prices will shoot up very high, wish I had like a 100 Switches on FW1.0
.
PS: But in my opinion anything is better than RCM+payload every boot, specially when not using a soldered chip inside, being constantly connecting something on the USB-C socket will make it last less and they are quite a huge hassle to replace, not very easy like fixing the Switch rails which is super easy
.