3DS noob here looking to dump my N3DS XL sysNAND before playing around with downgrading and what not. The procedure seems simple enough and I love to solder, so I'm not really worried about the practicality of it, I'm more concerned about the variation in the N3DS XL mainboard. The guides show a N3DS XL with a Samsung eMMC, my US N3DS XL doesn't have the same Samsung eMMC. I've been following the directions from several different sources, but mainly:
and
https://gbatemp.net/threads/n3ds-nand-backup-possible-i-hope.381506/ and
https://3dbrew.org/wiki/Hardware#New_3DS_XL
My question is, are the pinouts described here (https://3dbrew.org/wiki/Hardware#New_3DS_XL and https://gbatemp.net/threads/n3ds-nand-backup-possible-i-hope.381506/) for the N3DS XL using the Samsung eMMC the same for my system? See below.
SAMSUNG eMMC
MY N3DS XL (not sure what eMMC this is), IS THIS CORRECT?
Thanks in advance!
and
https://gbatemp.net/threads/n3ds-nand-backup-possible-i-hope.381506/ and
https://3dbrew.org/wiki/Hardware#New_3DS_XL
My question is, are the pinouts described here (https://3dbrew.org/wiki/Hardware#New_3DS_XL and https://gbatemp.net/threads/n3ds-nand-backup-possible-i-hope.381506/) for the N3DS XL using the Samsung eMMC the same for my system? See below.
SAMSUNG eMMC
MY N3DS XL (not sure what eMMC this is), IS THIS CORRECT?
Thanks in advance!